Electronics Forum | Fri Aug 13 11:21:15 EDT 1999 | Earl Moon
| | Ladies and Gentlemen, | | | | As a newly appointed DFM/CE "guru" here, one of my responsibilities has become repair (of course). As I have some knowledge of BGA repair/rework using semi-automated equipment, it naturally follows I would hav treme
Electronics Forum | Sun Mar 07 08:19:24 EST 1999 | Earl Moon
| | | | | | | | I'm having a fun time between BGA rework/repair using an SRT 1000 and SPC efforts (much easier) using DEK stencil printing processes and BTU reflow with 6 Fuji lines in between. | | | | | | | | Concerning the BGA stuff, I'm getting
Electronics Forum | Tue Sep 28 04:07:33 EDT 1999 | Jacqueline Coia
| | | | | | | Hiya, | | | | | | | | | | | | | | Could anyone please suggest recommended manufacturers of | | | | | | | IR rework stations for the removal of various SMT comps. | | | | | | | | | | | | | | Cheers | | | | | | | | | | | | | Why IR ?
Electronics Forum | Tue Sep 28 04:27:04 EDT 1999 | Wolfgang Busko
| | | | | | | | Hiya, | | | | | | | | | | | | | | | | Could anyone please suggest recommended manufacturers of | | | | | | | | IR rework stations for the removal of various SMT comps. | | | | | | | | | | | | | | | | Cheers | | | | | | | | | | | |
Electronics Forum | Thu Feb 04 18:45:56 EST 1999 | Earl Moon
| Actually, solder paste adds about 12% to the joint volume for PBGAs, or about 31% for MicroBGAs -- assuming standard (recommended) pad sizes and stencil thicknesses, and paste with 90% metal content (50% metal by volume). Michael, In the "real wo
Electronics Forum | Sat Mar 06 20:46:21 EST 1999 | Dean
| | | | | | I'm having a fun time between BGA rework/repair using an SRT 1000 and SPC efforts (much easier) using DEK stencil printing processes and BTU reflow with 6 Fuji lines in between. | | | | | | Concerning the BGA stuff, I'm getting about 60
Electronics Forum | Thu Sep 02 16:52:31 EDT 1999 | Earl Moon
| | | Has anyone done or seen any studies done documenting what may be the affect of hardware such as screws in the parimeter vicinity of BGAs on a circuit board? | | | | | | What I'm really after is anything describing how close a screw/washer/nut
Electronics Forum | Thu Mar 30 21:46:56 EST 2000 | Dave F
Reg: This is copy / paste from draft version of IPC 7095 ( issued May 1999 ) ... 7.3 Assembly accept/reject criteria 7.3.1 Voids in solder joint a. Sources of Voids There can be voids in solder balls, or at the solder joints to the BGA, or at the so
Electronics Forum | Mon Mar 08 18:21:42 EST 1999 | Earl Moon
> Alignment issues are not so critical on most any system, but thermal >>(top and bottom heater settings) certainly are. Without a serious >>system, I just don't see how it can be done. | | Thanks again Earl for your valuable communications.. | |
Electronics Forum | Mon Mar 25 21:50:10 EST 2002 | davef
Some of this was copped from Fred. There are numerous package types that now fall under the rubric of land grid array [LGA]. Land grid devices [ie, Bumped Chip Carrier� [BCC], LGA, Quad Flat-pack No-lead [QFN], MicroLeadFrame�, etc] are essentially
